SSR

Application Engineer at STMicroelectronics Inc., redefining presence sensing solutions with state-of-the-art occupancy sensing technology.

I am also an MSEE graduate from Tandon School of Engineering, New York University, Tandon School of Engineering., graduated in December 2022.

My areas of interest are MEMS Sensors, Embedded System Design, Wearable Sensors, Internet of Things (IoT), and Health Monitoring.

Education:

New York University, Tandon School of Engineering, Brooklyn, NY, USA
MS, Electrical Engineering
2021-2022
Universiti Teknologi Malaysia, Skudai, Johor, Malaysia
BEng, Electrical-Mechatronics
2016-2020

Experience:

  • Application Engineer II, STMicroelectronics, Schaumburg, IL (Jan '23 - Present)
    • Provide technical support of MEMS sensors and occupancy/presence sensing solutions
    • Define, develop, and present technical demos to aid promotional activities
    • Define, develop, and document lab activities such as device characterization, functional requirement per application requirement, root cause analysis, design document, and test reports
  • Field Application Engineer Intern, STMicroelectronics, Schaumburg, IL (June '22 - Dec '22)
    • Contributed to characterizing TMOS occupancy sensing technology for MEMS Application Team
    • Developed hardware and software of test equipment to enable automated testing routines for MEMS sensors
    • Aid in development of sensor data analysis/visualization

  • Research Assistant, Impact Innovation Lab, NYU Tandon School of Engineering (under Prof. Matthew Campisi) (Jan '22 - Present)
    • Contributed to the hardware and software integration through firmware development, hardware design and clinical research for ARMA, a biomedical device to monitor the progression of Rheumatoid Arthritis using Infrared Thermography
    • Conducted quantitative and qualitative comparison study of users’ thermographic hand images based on FLIR Lepton 3.5 and FLIR T630

  • Course Assistant, CS 2204, Department of ECE, Tandon School of Engineering, NYU (Sept ‘21 – Jan ‘22)
    • Conducting Lab sessions for Digital Logic and State Machine Design focusing on the synthesis of components using Verilog and demonstration on hardware using NEXYS 4 DDR FPGA board from Xilinx.
    • Assisting students during the open lab and office hours and grading assignments and quizzes.

  • Research and Development Intern, INNATES PLT, Johor Bahru, Malaysia. (June ‘19–Sep ’19)
    • Worked on a project named “Photovoltaic Energy Monitoring Systems (PVEMS, an Energy monitoring IoT Application for an offshore bunker“.
    • Design and implement circuit for CTH sensor, Analog-Digital Converter (ADC), microcontroller, communication gateway and programming backend server and database.

  • Research Assistant, Instrumentation Lab under Prof. Leow Pei Ling, UTM, Malaysia(Nov ‘17–May ’18)
    • Worked under the supervision of Assoc. Prof. Leow Pei Ling on the project “Sustainable Farming with Green Technology” and “Sustainable Temperature Control for Broiler House in Malaysia”. Performed experimental setup, data collection, data analysis, technical writing

Technical Skills:

  • Programming Languages: C/C++, Python, MATLAB, Assembly (RISC-V), Verilog.
  • Design, Modeling, Simulation: Simulink, COMSOL, NI LabView, Proteus, Modelsim, Tinkercad/SolidWorks.
  • MCU/Dev boards: Arduino, RaspberryPi, STM32 Family
  • Test Equipment: DMM, Logic Analyzer, Oscilloscope, Power Supply, Black body, Peltier Module, Thermographic camera, Power Amplifier (PA), Signal Generator, Spectrum Analyzer (SA)
  • Other tools and frameworks: mbed, STMCubeIDE, UNICO-GUI, SerialPlot, git, Linux AWS IoT.

Publications:

  • “Temperature Distribution Study for Malaysia Broiler House”.
    Lau K.X., Leow P.L., Jamian J.J.,Arsat, R., Abdeltawab A.A.A., Rahman S.S., Khalid N.H., A.Mohamed A.
    2nd International Conference on Smart Sensors and Application, ICSSA, 2018.

  • “Harvesting electrical energy from rooftop ventilator”.
    Lau K.X., Leow P.L., Jamian J.J.,Arsat, R., Abdeltawab A.A.A., Rahman S.S., Khalid N.H., A.Mohamed A.
    International Journal of Integrated Engineering., Vol.10, No.4, pp. 68-72, 2018.